Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
Electronics Forum | Thu Jan 06 09:03:57 EST 2005 | russ
It appears that this particular PCB supplier has a non-optimum HASL process along with other issues. It is much harder to completely remove the solder out of vias on thicker boards. Looks like more air pressure was needed to remove all of the exces
Electronics Forum | Thu Jul 14 19:05:24 EDT 2005 | valuems
Hi Sounds like a good idea, will get back with you. We are looking for as much feed back as possible. We have about 11 years experience on MPM's and we have several areas that we already have on our list. Have thought about putting the tac-tile on
Electronics Forum | Tue Oct 03 22:48:21 EDT 2006 | C.K. the Flip
It sounds as if this Sn100c HASL process is still in its infancy requiring further process development and characterization..weather its a better more active flux or a different profile... Given your situation of the Sn100c coating actually "repellin
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F
Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form
Electronics Forum | Thu Jun 08 07:56:34 EDT 2017 | jkitt84
In an excellent previous thread davef mentions brass should be plated prior to soldering to prevent zinc leaching from the brass. It is reported once the zinc leaches, the joint is weak. He recommends copper or nickel plating. Would silver plating w
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